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POLY-AVX ELECTRONICS LIMITED |
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SURFACE MOUNT MULTILAYER CERAMIC CAPACITOR |
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| General Specification of Surface Mount Multilayer Ceramic Capacitor (SMD) |
| DIELECTRIC |
COG/1B/NPO(A) |
X7R/2C1(C) |
Y5V/2F4 |
Capacitance Range |
See Individual Parts Specification |
See Individual Parts Specifications |
See Individual Parts Specifications |
Capacitance Tolerance |
C=+.25 pF, D=+.5 pF, F=+1%, G=+2%, J=+5%, K=+10%, M=+20% |
J=+5%, K=+10%,
M=+20% |
M=+20%,
Z=+80%,-20% |
Operating Temperature Range |
-55oC to +125oC |
-55oC to +125oC |
-25oC to +85oC |
Temperature Characteristic |
0+30 ppm/oC for C>20 pF As per CECC 32-101-801 for C<2opF |
+15% |
+30%, -80% |
Voltage Ratings (DC) |
50/63V, 100V |
50/63V, 100V |
50/63V |
Dissipation Factor |
<0.001% for C>50pF
<(150/C+7)x10-4forC<50pF
1MHz, 1VRMS(+0.2) for C<1000pF
1KHz, 1VRMS(+0.2) for C>1000pF |
2.5% max at 1 KHz
1VRMS(+0.2) |
3% max at 1 KHz 0.3 VRMS (+0.1) |
Insulation Resistance at rated voltage DC |
> 100G ohms or 1000 sec. whichever in less |
> 100G ohms or 1000 sec. whichever in less |
10G ohms or 100 sec. whichever in less |
Dielectric Strength |
250% of rated Voltage DC |
250% of rated Voltage DC |
250% of rated Voltage DC |
NOTE : POLY-AVX reserves the right to change the information herein without prior notice. |
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Manufacturing Range of Surface Mount Ceramic Capacitor |
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| DIELECTRIC |
COG/1B |
X7R/2C1 |
Y5V/2F4/Z5U |
| Size |
0603 |
0805 |
1206/1210 |
0603 |
0805 |
1206/1210 |
0603 |
0805 |
1206/1210 |
| VOLT (V) |
25 |
50 |
100 |
200 |
25 |
50 |
100 |
200 |
25 |
50 |
100 |
200 |
10 |
16 |
25 |
50 |
100 |
200 |
10 |
16 |
25 |
50 |
100 |
200 |
10 |
16 |
25 |
50 |
100 |
200 |
10 |
16 |
25 |
50 |
10 |
16 |
25 |
50 |
10 |
16 |
25 |
50 |
| CAP CODE |
| OR5-101 |
| 121-221 |
| 271-681 |
| 821-152 |
| 182-272 |
| 332-472 |
| 562-822 |
| 103-153 |
| 183-223 |
| 273-473 |
| 563-683 |
| 823-104 |
| 124-224 |
| 274-334 |
| 474 |
| 564-684 |
| 824-105 |
| 225 |
| 475 |
| 106 |
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| Manufacturing Range of Surface Mount Ceramic Capacitor |
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Note :
(1) 1812 SIZES ARE AVAILABLE ON REQUEST.
(2) ALL RANGES ARE FOR NICKEL BARRIER TERMINATIONS, MANUFACTURED AS PER CECC 32 101 801 SPECS.
(3) Z5U AVAILABLE ON REQUEST. |
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| Dimensions of Surface Mount Ceramic Capacitors. |
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Size |
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0603 |
0805 |
1206 |
1210 |
1812 |
(L) Length |
MM |
1.60 + 0.15 |
2.00 + 0.20 |
3.20 + 0.20 |
3.20 + 0.25 |
4.50 + 0.40 |
(IN) |
(0.063 + 0.06) |
(0.079 + 0.008) |
(0.126 + 0.008) |
(0.126 + 0.01) |
(0.177 + 0.016) |
(W) WIDTH |
MM |
0.80 + 0.12 |
1.25 + 0.20 |
1.60 + 0.20 |
2.50 + 0.25 |
3.20 + 0.30 |
IN |
(0.031 + 0.005) |
(0.049 + 0.008) |
(0.063 + 0.008) |
(0.098 + 0.01) |
(0.126 + 0.012) |
(T) THICKNESS |
MAX |
0.80 (0.12) |
0.50 (0.02) |
0.50 (0.02) |
0.80 (0.031) |
0.80 (0.031) |
MIN |
0.031 (0.005) |
1.40 (0.055) |
1.60 (0.063) |
1.60 (0.063) |
3.0 (0.118) |
(T) TERMINAL |
MIN |
0.25 (0.010) |
0.25 (0.010) |
0.25 (0.010) |
0.25 (0.010) |
0.25 (0.010) |
MAX |
0.65 (0.023) |
0.75 (0.03) |
0.75 (0.03) |
0.75 (0.03) |
1.00 (0.039) |
C |
MIN |
0.50 (0.02) |
0.50 (0.02) |
1.40 (0.055) |
1.40 (0.055) |
2.20 (0.09) |
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| Frequency of Surface Mount Ceramic Capacitor |
| The variation of capacitance and impedance under circuit operation conditions is dependent on the type of dielectric used. Typical graphs of the performance of these materials are given bellow |
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The variation of capacitance and impedance under circuit operation conditions is dependent on the type of dielectric used. Typical graphs of the performance of these materials are given bellow |
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| FREQUENCY |
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| Tape Dimension of Surface (mm) Mount Multilayer Ceramic Capacitor |
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TYPE |
DO |
P |
Po |
P2 |
E |
F |
G |
T |
8.0+0.3 |
C |
1.5+0.1,-0 |
4.0+0.1 |
4.0+0.1 |
2.0+0.05 |
1.75+0.1 |
3.5+0.05 |
0.75min |
1.1max |
8.0+0.3 |
P |
1.5+0.1,-0 |
4.0+0.1 |
4.0+0.1 |
2.0+0.05 |
1.75+0.1 |
3.5+0.05 |
0.75min |
0.3max |
12.0+0.3 |
P |
1.5+0.1,-0 |
8.0+0.1 |
4.0+0.1 |
2.0+0.05 |
1.75+0.1 |
5.5+0.05 |
0.75min |
0.1max |
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NOTE : The nominal Dimensions of the component compartment (Ao, Bo, K1) are derived from the component size. C = PAPER , P=PLASTIC |
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Reel Dimension of Surface Mount Multilayer Ceramic Capacitor |
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Nom. Tape width |
A |
W1 |
8 |
180 + 0,-2 |
8.4 + 1.50,-0 |
12 |
180 + 0,-2 |
12.4 + 2.0,-0 |
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| Surface Mount Multilayer Ceramic Capacitor Packing |
| CHIP STYLE |
TAPE & REEL(PAPER & PLASTIC) |
MAX. QTY. PER BAG |
SPOOL SIZE |
| 0805 |
4000/3000* |
5K |
180 mm |
| 1206 |
4000/3000* |
5K |
180 mm |
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| Application Notes for Surface Mount Multilayer Ceramic Capacitor |
| GENERAL : |
| Surface mounting chip multilayer ceramic capacitors are designed for soldering on printed circuit boards for other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. |
| HANDLING : |
| Chip capacitor should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of tweezers or vacuumed pick ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment taped and reeled product gives the ideal medium for direct presentation to the placement machine. |
| PREHEAT : |
| It is important to avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore required. The rate of preheat should not exceed 4oC/second and a target preheat of 2o C/second is recommended. Recent developments mean that for capacitors of 1206 size and below with a maximum thickness of 1.25 mm, it is now permissible to allow a temperature differentiate between the component surface and the soldering temperature of 150oC ( maximum ). In all other cases this differential should not exceed 100oC. |
| SOLDERING : |
| Mildly activated resin fluxes are preferred. The minimum amount of solder to give a good joint should be used. Excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. POLY-AVX terminations are suitable for all wave and reflow soldering system. Hand soldering is permissible. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature control model, not exceeding 30 watts should be used and set to not more than 260o C. Direct contact may be made to the metallization but must not be made to the ceramic body. |
| COOLING : |
| Natural Cooling in air is the most preferred condition as this minimize stresses within the soldered joint. Where forced cooling is used it should not exceed 4oC/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above. |
| CLEANING : |
| Flux residues may be hygroscopic or acidic and must therefore be removed. All chlorinated solvents are suitable for use with ceramic capacitors and particularly good results have been obtained using ultrasonic cleaning at the volume point of the solvent. Some water cleaning systems have also proved very successful. It may be noted here that a particular advantage of reflow soldering techniques is that flux ( usually as part of solder cream ) is only applied to the joints and thus cleaning is far easier than for wave systems where the whole assembly is fluxed. |
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